Intel President and CEO Paul Otellini was the main speaker for this mornings keynote and spoke about the state of Intel and the direction that the company was headed. If you are interested in what Intel will be up to in the near future this is worth a read!
Paul Otellini also showed displayed a 300mm silicon wafer containing the world's first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel microprocessors. The 22nm wafer displayed by Otellini is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at .092 square microns. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.
Article Title: IDF 2009: Keynote with Paul Otellini
Article URL: http://www.legitreviews.com/article/1082/1/