AMD and IBM Talk About 45NM Chips with Ultra Low-K

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AMD and IBM Talk About 45NM Chips with Ultra Low-K

Postby Apoptosis » Tue Dec 12, 2006 3:45 pm

AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45NM Chips

-- Advanced technologies provide improved performance and efficiency while reducing complexity in microprocessor design and manufacturing --

[quote]San Francisco, CA. -- December 12, 2006 --At the International Electron Device Meeting (IEDM) today, IBM (NYSE: IBM) and AMD (NYSE: AMD) presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008.

“As the first microprocessor manufacturers to announce the use of immersion lithography and ultra-low-K interconnect dielectrics for the 45nm technology generation, AMD and IBM continue to blaze a trail of innovation in microprocessor process technology,â€
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Postby dgood » Tue Dec 12, 2006 3:54 pm

Impressive, so what is the limiting factor on size in microprocessing? I mean how many atoms wide is .45 micrometer die?
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Postby Apoptosis » Tue Dec 12, 2006 3:56 pm

most atoms vary between 0.1 to 0.5 nanometers depending on what type, so plenty of room left ;)
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Postby dgood » Tue Dec 12, 2006 3:58 pm

nice, then they can make 8 processors on a board with 8 cores a peice. 8)
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Postby Xanlamin » Tue Dec 12, 2006 4:46 pm

Now if they could just make the release price smaller....but dont see that happening.
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Postby kenc51 » Tue Dec 12, 2006 4:50 pm

Apoptosis wrote:most atoms vary between 0.1 to 0.5 nanometers depending on what type, so plenty of room left ;)


Atoms are not the smallest things they can manipulate either.............
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