by infinitevalence » Thu May 27, 2004 9:30 am
Immortal it produces less heat and improves signal integrity allowing the ram to run at higher frequencies. When you have the solder points exposed like in regular TSOP(it think that’s what its called) the parallel nature makes the ram more susceptible to EMI and RF interference
"Don't open that! It's an alien planet! Is there air? You don't know!"