Legit Reviews

Yes, the thin halo between the copper and the solder should be SnCu intermetallic which is very brittle. It shows this construction is less reliable. In the leadframe type packages (very old technology), where pure Sn is plated on top of pure Cu, the thickness of the SnCu intermetallic is controlled...

I just registered to this forum to comment on this article. I feel the author made a lot of comments that are not backed up by science or test data. Lead free solder is much less reliable than Tin-Lead solder. Studies has been done in the past 20 years to find an alloy that has similar visco-elastic...