and TE Connectivity Releases Compatible, Single-Sided DDR3
Module Connectors
Technology Leaders Target the Ultrathin Computing Market With
Reduced-Height Module and Connector Solutions
- tech_promo_lg_single_sided_sodimm.jpg (25.12 KiB) Viewed 1200 times
BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron
Technology, Inc. (Nasdaq:MU), one of the world's leading providers of
advanced semiconductor solutions, and TE Connectivity (TE) (NYSE:TEL),
a world leader in connectivity, announced today the availability of a
Single-Sided SODIMM and a low-profile single-sided, double data rate 3
(DDR3) SODIMM connector solution to take advantage of the burgeoning
market for Ultrabook(TM) devices, convertibles, tablets and other thin
and light devices. Aimed at providing a reduced-height memory solution
for the ultrathin computing market, the new Single-Sided SODIMM,
developed by Micron, has components on either the front or back side of
the module, but not both. When paired with the single-sided DDR3 SODIMM
connector from TE, the total z-height of the overall solution from the
motherboard is just 3mm, a 35 percent savings compared to 4.6mm for a
standard SODIMM solution.
Micron's Single-Sided SODIMM is available in a 4GB, single-rank, x8
configuration. In addition to a reduced height, this new module is
built using 30nm DDR3L-RS components that consume less power in standby
compared to standard DDR3. Additionally, Single-Sided SODIMMs are
pin-to-pin compatible with current DDR3 modules, making them backward
compatible with existing DDR3 SODIMM connectors.
"Given the depth and breadth of ultrathin devices currently on the
market, coupled with consumer demands for sleek, lightweight designs,
Micron's objective is to offer solutions that meet the specialized
power, portability and battery life needs," said Kris Kido, Micron's
Director of Business Development, Computing Devices. "Micron's unique
Single-Sided SODIMM form factor meets those requirements and leads the
way for future developments in this growing segment."
TE engineers designed the new single-sided DDR3 SODIMM connector to
deliver peak performance with high-speed data applications. The
connector features a 35 percent reduction in height, compared with
similar low-profile connectors, which in turn, reduces the height of
the end-product by 5 to 10 percent. It also reduces motherboard shadow
area by nearly 156 mm2, or 312 mm2 for common dual-socket
implementation. The DDR3 SODIMM connector accepts modules that meet
JEDEC MO268 industry standards and is offered in both standard and
reverse types.
"It's clear that we're seeing devices, ranging from Ultrabook(TM)
devices to tablets, become increasingly thinner and sleeker," said Hook
Chang, product manager, TE Consumer Devices. "In the past, the
miniaturization of circuitry-powering device memory often compromised
reliability. Our DDR3 SODIMM connector solves that problem, ensuring
durable connectivity to optimize device functionality, speed and
usability. Micron Technology shares our commitment to provide consumers
with high-quality, reliable cost-effective solutions to maximize
product performance."
Availability
Single-Sided SODIMM samples are available from Micron now, with mass
production scheduled for Spring, 2013.
Single-Sided SODIMM connector samples are available from TE
Connectivity now, with mass production scheduled for June, 2013.
Micron Ultrathin Memory: Embracing the Future
With a global view of the mobile computing market, Micron is well
positioned to support the growth of ultrathin applications. Our broad
portfolio of industry-leading DRAM, SSD and NOR flash make
high-performance, ultrathin computing come to life in the time it takes
to snap your finger. Powerful, highly-responsive computing,
instant-on/instant-off, rapid application load times, super slim and
light designs, longer battery life and better power savings are all
possible with Micron's memory and storage solutions.
About Micron
Micron Technology, Inc., is one of the world's leading providers of
advanced semiconductor solutions. Through its worldwide operations,
Micron manufactures and markets a full range of DRAM, NAND and NOR
flash memory, as well as other innovative memory technologies,
packaging solutions and semiconductor systems for use in leading-edge
computing, consumer, networking, embedded and mobile products. Micron's
common stock is traded on the NASDAQ under the MU symbol. To learn more
about Micron Technology, Inc., visit http://www.micron.com.