TSMC Reports Fourth Quarter EPS of NT$1.26

[Apoptosis]

TSMC Reports Fourth Quarter EPS of NT$1.26

Hsin-Chu, Taiwan, R.O.C., January 28, 2010 -- TSMC today announced consolidated revenue of
NT$92.09 billion, net income of NT$32.67 billion, and diluted earnings per share of NT$1.26
(US$0.19 per ADS unit) for the fourth quarter ended December 31, 2009.

Year-over-year, fourth quarter revenue increased 42.6% while net income increased 162.5% and
diluted EPS increased 162.7%. Compared to third quarter of 2009, fourth quarter results
represent a 2.4% increase in revenue, a 6.9% increase in net income, and a 7.2% increase in
diluted EPS. All figures were prepared in accordance with R.O.C. GAAP on a consolidated basis.

Gross margin for the quarter was 48.5%, operating margin was 36.5%, and net margin was 35.5%.

As the global economy gradually recovered, fourth quarter saw a continued improvement in wafer
sales with computer related applications growing strongly and consumer related applications
declining seasonally.

Advanced process technologies (0.13-micron and below) accounted for 70% of wafer revenues.
90-nanometer process technology accounted for 16% of wafer revenues, 65-nanometer 30%, and
40-nanometer exceeded 9% of total wafer sales.

“Although first quarter normally is a sequentially declining quarter for all three major semiconductor
applications, we expect the demand from consumer related applications to grow in first quarter of
2010, while computer and communication related applications will decline following their seasonal
pattern,” said Lora Ho, VP and Chief Financial Officer of TSMC. “Based on our current business
outlook, management expects”:

• First quarter revenue to be between NT$89 billion and NT$91 billion, gross profit margin to
be between 46.5% and 48.5%, and operating profit margin to be between 35% and 37%;
• 2010 capital expenditure to be around US$4.8 billion, due to strong demand outlook for our
advanced technologies.

Profile
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process
technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference
flows. The Company’s managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including
capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s
wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first
foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For
more information about TSMC please visit http://www.tsmc.com.