http://www.tgdaily.com/content/view/39337/135/
MikeIt appears that Nvidia has changed its mind on making a hard transition from high-lead to eutectic solder bumps in its GPUs as a strategy to reduce the failure rates in its GPUs. Industry sources claim that Nvidia GPUs due in early 2009 will use the “old” underfill material. While this move does not necessarily result in continued failures, the decision certainly raises questions whether Nvidia has hit unexpected roadblocks in the use of eutectic material.
Industry sources told TG Daily that future 45 nm Nvidia GPUs that recently entered their qualification phase are being manufactured with high-lead solder bumps, raising questions about Nvidia’s recent switch to eutectic underfill in G84, G86, G92 and possibly more GPUs. While we were not able to confirm to which future Nvidia GPUs this information applies, we know that Nvidia is currently planning a GT206, a 55 nm replacement for the GTX260 due for launch late this year, as well as the 45 nm GT212, a new GPU that will be positioned as a new flagship GPU in Q1 of 2009.
Nvidia did not reply to our request for comment and the information why Nvidia may have decided to go again with high-lead solder bumps is largely left to speculation. The company may have figured out how to stretch the old underfill just a bit further. Concerned voices, however, believe that Nvidia may have hit unexpected electromigration problems in the high-led to solder transition and decided to play it safe with the GT212.
GPU failures apparently did not affect desktop-focused Nvidia GPUs before and it is likely that it won’t be the case with the GT212 either. However, Nvidia may face increasing pressure, if the transition to eutectic underfills isn’t going as smooth as indicated. Two lawsuits covering this issue have been filed (here and here), alleging that Nvidia’s has kept information problems under wraps for too long.
We will add more information as it becomes available.
