AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45NM Chips
-- Advanced technologies provide improved performance and efficiency while reducing complexity in microprocessor design and manufacturing --
[quote]San Francisco, CA. -- December 12, 2006 --At the International Electron Device Meeting (IEDM) today, IBM (NYSE: IBM) and AMD (NYSE: AMD) presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation. AMD and IBM expect the first 45nm products using immersion lithography and ultra-low-K interconnect dielectrics to be available in mid-2008.
“As the first microprocessor manufacturers to announce the use of immersion lithography and ultra-low-K interconnect dielectrics for the 45nm technology generation, AMD and IBM continue to blaze a trail of innovation in microprocessor process technology,â€
AMD and IBM Talk About 45NM Chips with Ultra Low-K
- Xanlamin
- Legit Aficionado
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Now if they could just make the release price smaller....but dont see that happening.
Franklin "Perry" Amo
Excalibur Systems, Inc.
President / Consulant
[email protected]
Excalibur Systems, Inc. LAN Project
Excalibur Systems, Inc.
President / Consulant
[email protected]
Excalibur Systems, Inc. LAN Project