simple 3200+ Barton question

killswitch83 · Post by **killswitch83** » Tue Jul 12, 2005 6:08 pm

Alright, this question involves temperature limits on the XP 3200+ Barton core. Right now, I have it sitting at around 49*C at idle and 50*C under a moderate, but not heavy, load (though I had SANDRA running CPU tests and it didn't get above 50*C). These temps are on stock cooling and AS5; does this sound about right (hate to sound like a noob, but I never really kept track of CPU temps before, and I'm just curious).

infinitevalence · Post by **infinitevalence** » Tue Jul 12, 2005 9:23 pm

It sounds a little high you might want to clean the heatsink. but you should be ok in that range i would not push it much over 50 if you can help it.

Bio-Hazard · Post by **Bio-Hazard** » Tue Jul 12, 2005 10:19 pm

IAW AMD's white paper on Electrical and Thermal Specifications for the Advanced 400 FSB AMD Athlon™ XP Processor Model 10, Chapter 7, Page 25, the Maximum Die Temp is 85c. Would I ever run my CPU that warm, not on your life. But the millions of OEM system out in the world are setup to run on that standard, so it won't kill your CPU in theory no, but it will shorten it's life span over a CPU that never gets hotter than 50c.

Post by **Apoptosis** » Wed Jul 13, 2005 1:39 am

It sounds about right for a stock cooler and a case with little or low air flow. I'm sure you know how to apply thermal compound, but you might want to re-apply the AS5 and make sure you have a really thin layer applied to the base of the HSF. You almost want to be able to see the HSF base through the compound when done correctly. Less is usually better when it comes to thermal paste.

killswitch83 · Post by **killswitch83** » Wed Jul 13, 2005 8:21 pm

Well, I did reapply the thermal paste already because I thought the temps were too high the first time, which are the same temps I'm currently getting now after that second application. I took the necessary safeguards concerning the removal of foreign contaminants using 91% pure alcohol and applying a thinner layer the second time around due to the fact that AS5 absorbs into the valleys in the HSF. BTW, thanks Biohazard for the white page specs, I couldn't seem to find them on the AMD website. However, this may help you guys; I'm using an older model Inwin full server case (QX series I believe, yeah this case is close to three years old) with a PowerMax 300W PSU that has no sort of wire-routing devices inside, so as you can probably tell, the peripheral and yes even the main power connector is giving me a hard time in terms of routing, but I am running Antec round cables (definitely not the cheezy, bundled-up flat cables that come with the mobo). Still, I really need advice as to proper routing, because I have three 80mm case fans (in other words, where there's a mount for a fan, I have one): one in the front of the case near the bottom acting as an intake fan, one under the PSU on the back of the case as an exhaust, as well as one above the PSU. The way I figure it, I'll get the necessary tiebacks and whatever for this case, but if this requires a stronger HSF, perhaps a Zalman AlCu type HSF or equivalent, then the customer is going to dish out the dough (usually when I build a system I add extraneous mounting hardware and the such into the cost of the system, as miniscule a cost as it is). Tell me what you guys think, because, as I reiterate, the AS5 is applied correctly.