Do Not Remove Heat Spreaders on BGA Memory

Post by **Apoptosis** » Fri Sep 10, 2004 10:09 am

With the recent move to DDR2 memory modules we have seen a shift to BGA IC's being used. These IC's use a ball-grid-array (bga) and are not using the "legs" that were used on the TSOP IC's of the past. This newer IC is better, but one downside of it is how stronglyit attaches.

I strongly urge you not to remove the heat spreaders on any BGA memory to "see what IC's" you have. No matter how careful you are and how many times you have done it. Trust me...

This is on a pair of Crucial Ballistix PC2-5300 modules. How would you explain that one to the RMA department? Trust me it is not covered.

Post by **Illuminati** » Fri Sep 10, 2004 12:22 pm

Hey... I have an interesting question...

DOES IT STILL WORK?

I'm curious if it still works and just shows as having a little less memory.... Let us know... hehe.

eric m. · Post by **eric m.** » Fri Sep 10, 2004 1:15 pm

there is no way that still works. i am just making an educated guess but knowing how those kinds of ICs work, it might show up at POST but you are going to have all kinds of crazy problems trying to boot up your OS. it probably wouldn't permanently hurt anything but i don't think it will run smoothly or anything, if it even works at all.

Immortal · Post by **Immortal** » Fri Sep 10, 2004 1:29 pm

yeah thats been cleanly ripped off the PCB, i dont think ul get any power to it and even if you do the signal quality will be so abismal that ur gonna overloaded with memory errors.