Do Not Remove Heat Spreaders on BGA Memory
Posted: Fri Sep 10, 2004 10:09 am
With the recent move to DDR2 memory modules we have seen a shift to BGA IC's being used. These IC's use a ball-grid-array (bga) and are not using the "legs" that were used on the TSOP IC's of the past. This newer IC is better, but one downside of it is how stronglyit attaches.
I strongly urge you not to remove the heat spreaders on any BGA memory to "see what IC's" you have. No matter how careful you are and how many times you have done it. Trust me...

This is on a pair of Crucial Ballistix PC2-5300 modules. How would you explain that one to the RMA department? Trust me it is not covered.
I strongly urge you not to remove the heat spreaders on any BGA memory to "see what IC's" you have. No matter how careful you are and how many times you have done it. Trust me...

This is on a pair of Crucial Ballistix PC2-5300 modules. How would you explain that one to the RMA department? Trust me it is not covered.