High-Speed, High-Density Flex II Memory Modules Harness the Overclocking Capabilities of Water Cooled Systems
Sunnyvale, CA—April 10, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex II memory series, designed for blazing speeds demanded by enthusiasts. These premium modules run at incredibly fast DDR2-1150 speeds for high-performance systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC2-9200 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.
The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC2-9200 Flex II memory module features this breakthrough thermal management technology from OCZ. Combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs, Flex II effectively dissipates heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
“One of the side effects of extreme memory speeds is an increase in performance robbing heat, and the new Flex II modules are among the most powerful memory solutions in the market place yet are able to remain cool and stable with an innovative new cooling design,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “The thermal power is addressed using what we believe is the most advanced memory cooling solution currently available, suited for either liquid or air cooling system configuration to unleash the full power of 4 GB of DDR2 at the highest possible frequency.”
The PC2-9200 Flex II modules are optimized for the latest cutting edge platforms and will be available in high-capacity 4GB (2x2048MB) dual channel kits for the latest gaming, 64-bit operating systems, and CAD applications. In its continued effort to make overclocking a user-friendly pastime, OCZ includes all the necessary accessories right in the box to setup your unique water-cooling system immediately after purchase, without the inconvenience of searching for additional hardware. As part of OCZ’s line-up of premium memory, the Flex II series is backed by a Lifetime Warranty and industry-leading technical support.
Harnessing the elite performance of high speeds, tight timings, and leading-edge heat dissipation, the unparalleled design of the new Flex II is a complete, all-encompassing solution certain to set a new standard for serious enthusiasts.
For more information on the OCZ Flex II PC2-9200 4GB Kit, please visit our product page here.
About OCZ Technology Group, Inc.
OCZ Technology Group, a member of JEDEC, designs, develops and manufactures ground-breaking, high performance memory and computer components that set industry standards. OCZ products are the first choice for users needing high-reliability, ultra-high performance solutions. In 2007, PC Power & Cooling and Hypersonic PC were brought into the OCZ Technology Group, forming a well-rounded, highly innovative organization that places the company at the forefront of high-end computing. All of OCZ Technology Group's products are available through its worldwide network of distributors, online resellers and retail stores. For more information visit our website at http://www.ocztechnology.com
